MET-E
Module Testing & Encoding Machine
--Batch module encoding for perso efficiency
Technical Solutions:
Max Throughput：28000pcs/h
Dimensions：4000×800×1800mm
Weight：650kg
Punching precision: less than±200um(X and Y direction), CPK>1.33.
Tape（FCI）precision：200 transfer hole(about 66 module each row) ±760um.
Advantages:
Suitable for Dual interface, contact and contactless module.
Online rewrite.
Workstation Solutions：
Suitable for Contact and contactless
Two sets of rewinding and unwinding units.
2 contact rewriting stations
1 punching stations
Chip Module punching unit：
Quantity of mold can be customized.
Modular design, can work independently and also can be combined with electric testing module.
